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Product category: Analogue and Mixed Signal ICs
News Release from: Farnell
Edited by the Electronicstalk Editorial Team on 15 November 2007

Novel packaging handles ICs with care

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Peel packaging offers complete protection to each individual component in transit, storage and handling by placing them within a protective, recyclable and biodegradable plastic cell.

Farnell has introduced an innovative packaging solution for ICs that it reckons will benefit its customers worldwide Peel packaging offers complete protection to each individual component in transit, storage and handling by placing them within a protective, recyclable and biodegradable plastic cell which is then sealed with an antistatic lid