Product category: Standard Logic Devices
News Release from: Fairchild Semiconductor | Subject: TinyLogic MicroPak 8
Edited by the Electronicstalk Editorial Team on 20 June 2003
Logic package is
a tough little blighter
MicroPak 8 is a new eight-terminal chip-scale leadless package for 1, 2 and 3bit logic and switch functions
The new TinyLogic MicroPak 8 package offers 60% space savings over leaded US8 packages while maintaining 0.5mm terminal pitch. This allows designers to take advantage of the dramatic size reduction to incorporate product improvements or to implement new designs while utilising existing component-mounting processes.
This article was originally published on Electronicstalk on 20 June 2003 at 8.00am (UK)
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Fairchild MicroPak 8 devices are ideal for use in PDAs, cellphones, digital cameras, notebooks and other ultra-portable applications.
The large, 0.2 x 0.3mm land grid array (LGA) contact pads assure strong joint integrity essential for reliable operation under harsh environmental stresses such as excessive keyboard pressure and over-temperature conditions.
Offered now in MicroPak 8 is the UHS high-performance low-voltage logic family that includes triple buffers, dual tristate buffers, dual gates, flip flops, dual analogue and bus switches.
Later this year, new high-performance 1, 2 and 3bit ultra-low-power (ULP) and ULP-A logic functions, designed for 0.9 to 3.3V operation, will be offered in MicroPak 8.
"MicroPak's encapsulated chip-on-substrate approach provides relatively large mounting terminals that support high insertion yields and allow rapid implementation and swifter adoption into the new generation of portable products", says Ken Murphy, Fairchild Product Launch Manager for Logic Products.
"By using LGA technology with large area terminal pads on the substrate, MicroPak packaging provides a rugged attachment to the PC board, making it extremely reliable over a wide range of mechanical and temperature stresses".
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