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Product category: Discrete Power Devices
News Release from: Fairchild Semiconductor | Subject: FDS7066SN3
Edited by the Electronicstalk Editorial Team on 30 April 2003

SyncFET saves space, heat
and time for PSUs

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The FDS7066SN3 is the first in a new family of MOSFETs using SyncFET silicon technology to improve performance and reduce overall system cost in synchronous DC/DC buck convertor designs

The FDS7066SN3 is the first in a new family of mosfets using Fairchild's FLMP (flip leaded moulded package) and SyncFET silicon technology to improve performance and reduce overall system cost in synchronous DC/DC buck convertor designs. With an integrated Schottky diode, the device's SyncFET technology offers similar performance (high power and current handling) of a separate mosfet and Schottky rectifier in one package.

This integration reduces space by as much as 50% and provides cost savings and manufacturing throughput (or "time") savings.

By using Fairchild's highly efficient FLMP SO-8 packaging combined with SyncFET technology, the performance improvements are even greater.

With high thermal efficiency (thermal resistance junction-to-case of 0.5degC/W) and a very low on resistance (4.5mohm typical at 10V), the 30V, 19A N-channel mosfet is an ideal solution for the low-side switch used in synchronous buck DC/DC convertor applications.

Making use of technology patented by Fairchild, the SyncFET monolithic die solution incorporates a titanium Schottky diode with a PowerTrench mosfet, allowing Fairchild to match the performance of the Schottky to the requirements of the mosfet to prevent the mosfet body diode from turning on.

This greatly improves reverse recovery gate charge (QRR) and reverse recovery time (trr) characteristics - the FDS7066SN3 has a QRR of only 28nC and a trr of 26.6ns (both at IF=19 A, di/dt=300A/us).

Reducing the reverse recovery charge also helps to increase the overall operating efficiency in the DC/DC convertors.

In addition, replacing the lower mosfets with a SyncFET of the same on-resistance can result in substantial efficiency improvements upwards of 5%.

Fairchild's FLMP package offers the thermal performance and very low on resistance of a much larger TO-263 in a standard SO-8 package outline.

This packaging allows the FDS7066SN3 to achieve thermal resistance junction-to-case of 0.5degC/W compared with the 25degC/W of a standard SO-8.

It also improves power dissipation: a standard SO-8 dissipates 2.5W versus a FLMP, which dissipates 3W.

Combined with SyncFET technology, FLMP packaging allows products to run much cooler to enhance system reliability, and cut board space by half, to greatly simplifying layout and reduce component count.

The FDS7066SN3 is part of Fairchild's complete portfolio of SyncFETs, offering a wide range of single and dual solutions in industry standard and tailored pinouts.

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