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Product category: Standard Logic Devices
News Release from: Fairchild Semiconductor | Subject: MicroPak packaging for TinyLogic
Edited by the Electronicstalk Editorial Team on 24 April 2001
Flat-bottomed packages shrink logic
devices
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Fairchild Semiconductor has added an option of MicroPak packaging to its TinyLogic portfolio, claiming the most significant space savings available in the logic market.
Fairchild Semiconductor has added an option of MicroPak packaging to its TinyLogic portfolio, claiming the most significant space savings available in the logic market Designed with a footprint of only 1.45 by 1.00mm and a height of only 0.55mm, MicroPak is 65% smaller than the SC70 package
This article was originally published on Electronicstalk on 28 Feb 2001 at 8.00am (UK)
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