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Product category: Electronics Manufacturing Services
News Release from: EDA Solutions | Subject: Mosis MPW service
Edited by the Electronicstalk Editorial Team on 14 September 2006
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Mosis has signed a strategic agreement with Sempac that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits.
Mosis has signed a strategic agreement with Sempac that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits The deal will give customers who use the Mosis multiproject wafer (MPW) service access to QFN/MLP, QFP and SOIC/SSP packages from Sempac's Open-Pak product line
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