Product category: Wireless Communications
News Release from: Epcos | Subject: R005 module
Edited by the Electronicstalk Editorial Team on 17 November 2003
Complete front end
for dual-band wireless LAN
A novel all-in-one module integrates the complete dual-band front-end circuitry for wireless LAN devices in a package measuring only 5.4 x 4.0 x 1.4mm
The new R005 module combines two duplexers, two receive filters, two transmit filters and an antenna diversity switch in a single component. It is designed for use with WLAN chipsets that conform to the IEEE802.11 b/g/a standard, operating in the frequency bands from 2.4 to 2.5GHz and from 4.9 to 5.9GHz.
This article was originally published on Electronicstalk on 17 November 2003 at 8.00am (UK)
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This breakthrough in integration and miniaturisation is the result of Epcos' mastery of low-temperature cofired ceramic (LTCC) technology.
Epcos offers various front-end types in its new family of WLAN modules.
With footprints of 5.4 x 4, 6.7 x 5.5 and 8.5 x 5mm, they are compatible with industry-leading WLAN chipsets and offer optional functions such as integrated baluns and directional couplers for RF power monitoring.
"By launching the WLAN modules, we are extending our product range of GSM ceramic modules in a key growth market.
Epcos has once again demonstrated its acclaimed high competence in integration, which is based on decades of experience in ceramic technology and chip-size packaging", said Dr Werner Faber, President of the SAW Components Division.
Wireless local area networks permit fast and economical configuration of private networks, connecting terminals with each other and the Internet at data rates up to 54Mbit/s.
As the share of WLAN-enabled notebooks, PDAs and mobile terminals keeps growing, integrated front-end modules save considerable board space, simplify circuit design and cut costs in comparison with today's discrete solutions.
Further customer benefits common to the WLAN and GSM module lines are increased functionality, high reliability, shorter development times and minimum component count in the end product.
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