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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Endicott Interconnect Technologies | Subject: CoreEZ organic substrates
Edited by the Electronicstalk Editorial Team on 07 April 2008
Production deal secures organic
substrate supplies
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Substrates offer a very dense, thin core, build-up flip-chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set.
Endicott Interconnect Technologies has signed a sales and manufacturing agreement whereby Unimicron Technology Corp of Taiwan will produce CoreEZ organic substrates at one of its facilities As the original design manufacturer, Endicott will maintain control of the design and technical support worldwide for the CoreEZ product line