Product category: Electronics Manufacturing Quality Assurance
News Release from: SolderStar | Subject: SolderStar Lite, Plus and Pro
Edited by the Electronicstalk Editorial Team on 24 March 2006
Thermal profiling packages cover all
budgets
Three easy-to-use thermal profiling packages cover the demanding technical and budgetary requirements of low, medium and high volume lead-free electronics manufacturing environments.
SolderStar will use Nepcon Shanghai to launch three easy-to-use thermal profiling packages, designed specifically for the demanding technical and budgetary requirements of low, medium and high volume lead-free electronics manufacturing environments - SolderStar Lite, SolderStar Plus and SolderStar Pro Since it opened its doors for business just four years ago, UK-based thermal profiling specialist SolderStar has developed a line of thermal profiling instruments and software for the electronics industry that is second to none in terms of technology, ease of use, breadth of range and price performance
This article was originally published on Electronicstalk on 19 Nov 2002 at 8.00am (UK)
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