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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Dow Corning | Subject: Dow Corning DA-6534
Edited by the Electronicstalk Editorial Team on 09 May 2007
Adhesive helps keep flip-chip BGAs cool
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High-performance thermal adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity.
To address the issue of overheating in advanced flip-chip ball grid array (FC-BGA) devices, Dow Corning Electronics has unveiled its Dow Corning DA-6534 high-performance thermal adhesive This unique, one-part adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures, providing long-term reliability for today's leading-edge semiconductor devices