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ELECTRONICSTALK
The Independent Weekly Product Information Guide
for Electronics Engineers
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London, UK
ISSN 1470-627X - Free Circulation
Published every Tuesday at 12:30 (UK)
Issue 1: 6 February 2001
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620 product announcements and technical articles
on our web site, all fully searchable at
- take a look!
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In this issue:
* Editor's Message
* Our Top Ten new Products Selection
1. Stacked BGA crams in chips for compact designs
2. Power switch ICs support new USB wake-up specs
3. FPGAs updated over the web
4. Analyser covers all major cellular standards
5. Credit-card-sized PC
6. Greenpar comes back with low-cost coax connectors
7. Cypress puts USB 2.0 control all in one chip
8. Leadless leadframe package shrinks LDO
9. Accelerator IP puts Java in hardware
10. Detectors protect and survive the blast
* New Technical Articles and Case Studies
* ...And take a look at these stories too...
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Laurence Marchini, Editor, writes: Here's a little bit of history... the first Electronicstalk Newsletter. We hope you find it worthwhile.
Although I didn't set out to "theme" this week's contents, the majority of this week's top products do share a common thrust: the eternal quest for ever-more-compact design. And the battleground has shifted.
Twenty years ago as a young(ish) cub reporter, I was continually impressed by the levels of integration possible with these new-fangled integrated circuit thingies. Since that time, of course, geometries have shrunk dramatically, and Moore's Law has almost held its own.
Latterly, the greater problem has become not so much what can be done on a chip, but how that chip fits into the overall scheme of things. Electronics packaging is playing catch-up. The dual-inline package of 20 years ago is almost a museum piece. Practical three-dimensional packaging is upon us. What next? I may not be brave enough to make any predictions about that, but we'll be here to tell you about it as soon as it happens.
I hope you find this issue of our weekly newsletter useful. In addition to the new products, news and ideas featured here, there are hundreds more on our website and dozens more being added daily, so do take a look if you can. But you don't need web access! All the full stories behind the summaries and headlines in this newsletter can be retrieved by email alone: see details below. In the meantime, if you've got any suggestions as to how we might make the site or the newsletter better, email me directly.
Best wishes
Laurence Marchini, Editor
lauren[-email removed-]nicstalk.com
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THIS WEEK'S INDUSTRY NEWS
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FUJITSU TAKES USB IP FROM INSILICON
inSilicon Corp has announced a technology licensing agreement to provide its enabling USB 2.0 communications technology for use in SOC devices from Fujitsu's Electronic Device Group.
inSilicon Corp, 1 February 2001
[-email removed-]ectronicstalk.com>
MONTAVISTA PUTS HARD HAT LINUX ON MIPS
MontaVista Software is to join the MIPS Alliance Program (MAP).
MIPS Technologies, 1 February 2001
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MOTOROLA AND SURF TO DEVELOP ACCESS SOLUTIONS
Surf Communication Solutions and Motorola are to provide bundled silicon and software solutions aimed at the high-growth telecommunications access market.
Surf Communication Solutions, 2 February 2001
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HAWNT GOES LIVE WITH E-COMMERCE WEBSITE
Hawnt Electronics has launched an e-commerce website that combines the company's full catalogue with up-to-the-minute stock availability and quotations together with secure online ordering.
Hawnt Electronics, 6 February 2001
[-email removed-]ectronicstalk.com>
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OUR TOP TEN NEW PRODUCTS SELECTION
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1. Stacked BGA crams in chips for compact designs
ST Assembly Test Services (STATS) has launched a new integrated circuit package for the wired and wireless communications markets. The new Stacked Die Ball Grid Array (SDBGA) is distinguished by its stacking feature, combining various ICs in one package, which can significantly reduce not only manufacturing cost but also reduce testing time and real estate on the motherboard. Both the mounting area and chip weight of an SDBGA can be reduced as much as 70%, compared with conventional packages. With its two-in-one feature, the total SDBGA package height is typically 1.4mm. Popular SDBGA sizes range from 8 x 8 to 14 x 14mm, with pin counts between 80 and 140.
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2. Power switch ICs support new USB wake-up specs
The industry's first USB power switch ICs to address the new Advanced Configuration and Power Interface (ACPI) wake-up capabilities are now available from Micrel Semiconductor. The new devices in the MIC2010 series include four dual-channel protected MOSFET switches optimised for Universal Serial Bus (USB) wake-up capabilities supported by ACPI for desktop PCs.
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3. FPGAs updated over the web
Celoxica has announced the DK1 design suite, software that enables a fundamentally new approach to the design of electronic hardware. DK1 permits the rapid design of electronic products and exploits hardware upgrading via the Internet to better manage the lifecycle of products once they are in the field. The DK1 design suite represents a new approach to the rapid development of FPGA and system-on-chip designs. With DK1, engineers use Handel-C, a high-level language based on ANSI C, to write complex algorithms targeted for migration to hardware. Unlike previous approaches, which require translation of C-like language code into intermediate hardware description languages, DK1 provides migration from C code to hardware.
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4. Analyser covers all major cellular standards
Anritsu has launched the MT8801C radio communications analyser, offering the capability to test the latest internet mobile phones quickly and efficiently. The MT8801C will, for the first time, allow manufacturers of mobile phones to test their products on the production line in a fast and efficient way.
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5. Credit-card-sized PC
According to Datasound Laboratories, with its credit-card-sized package, the smartModule is the perfect choice for OEMs seeking high performance in the smallest of footprints. With all signals and interfaces connected to the smart480bus connector, the module needs no cabling. The P5PC smartModule integrates with a P5 CPU and in addition to all common PC interfaces; it also includes video.
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6. Greenpar comes back with low-cost coax connectors
A new family of coax connectors, specifically designed to meet the price-performance requirements of commercial RF applications in sectors such as broadcast, data networking, industrial electronics and instrumentation has been announced by Tyco Electronics. Carrying the well-known Greenpar brand, which is now re-emerging under Tyco Electronics, the products are manufactured using the same high-quality base materials to satisfy the performance criteria of these sectors without the price premium often associated with such products.
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7. Cypress puts USB 2.0 control all in one chip
Cypress Semiconductor reckons its EZ-USB FX2 is the world's first USB 2.0 integrated peripheral controller. The device includes an 8051 processor, a serial interface engine, a USB transceiver, on-chip RAM and FIFO and a general programmable interface. FX2 is a fully-integrated solution, requiring less board space and providing faster time to market. The EZ-USB FX2 has a novel architecture, including a smart serial interface engine, which handles all basic USB functions, freeing the embedded MCU for application-specific functions and ensuring sustained high-performance transfer rates.
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8. Leadless leadframe package shrinks LDO
National Semiconductor has introduced a full-featured 500mA low dropout (LDO) voltage regulator for medium-level current applications in computing devices and portable products requiring low-noise voltage conversion. The precise micropower LP2989, housed in a chip-scale, leadless leadframe power package (LLP), is designed to fit the tight space requirements of compact portable designs. The LLP package measures just 4.0 x 4.0mm, has a low profile of 0.8mm, and a pin pitch of just 0.8mm.
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9. Accelerator IP puts Java in hardware
inSilicon Corp has introduced the JVXtremeT Accelerator, a performance-enhanced extension of the company's proprietary JVXT JavaT acceleration technology announced last June. Adaptable to a variety of profiles ranging from televisions to personal digital assistants (PDAs) and automobiles, the JVXtreme accelerator is targeted to performance-demanding embedded applications such as set-top boxes, advanced PDAs, and next-generation mobile phones.
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10. Detectors protect and survive the blast
Micro Circuit Engineering (MCE) and Matra BAe Dynamics are collaborating in the promotion of a family of nuclear event detectors which will protect electronic systems from one of the effects of a nuclear incident.
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New Technical Articles and Case Studies
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NET INSIGHT USES TOSHIBA ASIC FOR 8GBIT/S SWITCH
Stockholm-based Net Insight AB has developed a high-performance, single-chip, multi-service switch capable of speeds up to 8Gbit/s using advanced ASIC technology from Toshiba.
Toshiba Electronics Europe, 2 February 2001
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CONTROLLER AIDS VOICE-OVER-IP APPLICATIONS
Intersil is addressing the need for more reliable, toll grade voice-band telephony in broadband systems with a new gateway controller IC for use in Voice-over-Internet Protocol applications.
Intersil, 5 February 2001
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WHITE LED DRIVER IC LIGHTS UP CELLPHONES
Rohm has launched a device that will simplify the design of mobile phones requiring full colour backlights by delivering the increased voltages and driving functionality demanded by white LEDs.
Rohm Electronics (UK), 6 February 2001
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STYLISH, SLIMLINE 12IN TOUCHSCREEN LCD MONITOR
WASP has introduced a stylish, slimline 12in touchscreen LCD monitor.
WASP, 5 February 2001
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COMPACTPCI CONNECTORS FEATURE HOT-SWAP CODING
The new MJ04 series 2mm metric connector system from JAE complies with the IEC 1076-4-101 electrical and mechanical specification for CompactPCI interconnection.
JAE Europe, 6 February 2001
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LCR BRIDGE SETS NEW PRICE-PERFORMANCE STANDARD
The LCR400, new from TTi (Thurlby Thandar Instruments), is a precision LCR bridge with a built-in 4-terminal test fixture and a full limits comparator for component sorting.
TTi (Thurlby Thandar Instruments), 5 February 2001
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SENSOR OPENS UP NONCONTACT VIBRATION TESTING
Polytec has developed a laser doppler vibrometer (LDV) which it claims overcomes the usual barriers to online vibration testing of products during the manufacturing process.
Polytec, 6 February 2001
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