Product category: Design Services
News Release from: DfR Solutions
Edited by the Electronicstalk Editorial Team on 3 April 2006
Study to investigate
end-of-life solder behaviour
DfR Solutions has been selected by Nihon Superior to undertake a comprehensive investigation on the reliability of its SN100C tin-copper-nickel-germanium solder
DfR Solutions has been selected by Nihon Superior to undertake a comprehensive investigation on the reliability of tin-copper-nickel-germanium solder (SN100C), a lead-free alloy exclusively patented by Nihon Superior in 24 countries to date. A true eutectic solder with superior solderability, a reflective surface and ductile behaviour, SN100C has become the lead-free alloy of choice for wave soldering applications.
This article was originally published on Electronicstalk on 3 April 2006 at 8.00am (UK)
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This broad usage has allowed the intrinsic reliability of SN100C to be demonstrated through the successful manufacture and use of over 300 million printed circuit board assemblies during the past five years.
This study spearheaded by Nihon and DfR Solutions is directed at generating data necessary for the development of models for predicting end-of-life behaviour.
A particular focus of this study will be the reliability of reflowed assemblies, an area of increasing use of the SN100C alloy that was originally developed for wave soldering.
To provide users with a better understanding of the long-term reliability of SN100C solder, DfR and Nihon have developed an experimental design that will accurately capture the performance of SN100C over a wide range of environmental conditions.
Specially designed test coons will be tested to failure while being subjected to thermal cycling, vibration and mechanical shock after long-term aging.
Using DfR's expertise in physics of failure (PoF) and extensive knowledge of solder joint degradation, the output of this programme will provide customers of SN100C the tools and models necessary to predict end-of-life behaviour.
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