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Product category: PCB Assembly Equipment and Tools
News Release from: DEK
Edited by the Electronicstalk Editorial Team on 21 November 2005
Report details lead-free stencil
requirements
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A new report reveals how stencil aperture dimensions must be increased when working with lead-free pastes to ensure adequate wetting forces and thereby prevent tombstoning.
DEK has published its latest findings on screen printing with lead-free pastes, focusing on the implications for stencil design rules The results also underline the importance of using an enclosed head and nickel stencils to maximise quality and yield
This article was originally published on Electron