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Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Virtual Panel Tooling
Edited by the Electronicstalk Editorial Team on 12 September 2005
Tooling technology accelerates
processing
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DEK has developed an innovative, robust multiple chip package solution claimed to dramatically reduce cycle time while delivering unmatched accuracy and repeatability.
Recognising that individual processing of chip packages is inefficient and traditional multiple-package processing using dispensing can be slow and defect-ridden, DEK has developed an innovative, robust multiple package solution that dramatically reduces cycle time while delivering unmatched accuracy and repeatability DEK's singulated substrate system can be used to process multiple packages in the same cycle