Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK
Edited by the Electronicstalk Editorial Team on 5 October 2004
Top award for mass imaging platform
DEK's new Micron-class high accuracy mass imaging platform is the assembly solution of the year, according to the judges at the Electronic Industry Design Awards
The important technologies designed into the Micron-class, which includes the Europa and Galaxy configurations, caught the panel's imagination over strong entries by other equipment and material developers. "The Micron-class is architected to deliver unprecedented speed and accuracy for the coming generations of SMT and semiconductor package assembly", said DEK's Rich Heimsch.
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"It is the result of our 'one generation ahead' design philosophy".
"Perhaps more importantly, our innovations to maximise uptime and reduce cost of ownership, including some unique application of Controller Area Network and Internet technologies, will change the operator and ownership experience forever".
These technical assistance and process support resources, being tightly linked with the mass imaging platform itself, were a key reason for Micron-class' success.
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The revolutionary DEK Instinctiv user interface now allows operators to confidently control extremely complex processes with less training than before.
Features including intuitive graphical displays for consumable levels, with an indication of actual time before replenishment of solder paste, solvents and USC rolls allow operators to control the new machines more efficiently than ever before.
Onboard error recovery maximises up-time and allows nonexpert staff to quickly take the optimal corrective action to restore full process functionality.
Micron-class machines also benefit from IP-based connection to DEK knowledge servers via the Internet.
This service, known as DEK Interactiv, allows the user to establish communication with a DEK telephone helpdesk at the push of a button, and to share control of the machine with the helpdesk operator via the Internet.
Access to the content held on DEK's knowledge servers allows the operator to view tutorials, graphical examples and user guides for a wide range of machine subsystems and processes.
These include setting up tooling or inspection, optimising machine and process parameters and fine-tuning programs for optimum productivity.
The new platform is also fully compatible with important innovations such as DEK Virtual Panel Tooling, which allows multiple singulated substrates to be imaged simultaneously, and semiconductor packaging solutions such as Direkt ball placement.
The latest ProFlow Direkt imaging developments, including the low volume transfer head for high value materials such as low-alpha solder pastes or conductive epoxies and thermal interface materials can also be used directly with Micron-class machines.
"DEK's Micron-class is indeed the manufacturing solution of the year, and I am delighted that EID has recognised this by presenting the award to Galaxy at the EID awards dinner", concluded Heimsch.
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