Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK | Subject: Additive stencil technology
Edited by the Electronicstalk Editorial Team on 18 June 2004
Additive stencil technology boosts throughput
DEK's latest additive stencil technology allows users to create deposits of several heights in a single pass, to increase throughput, reduce the number of process steps, and increase equipment use
DEK's solution to creating multiple deposit heights also enhances the lifetime of squeegee blades or the wipers of an enclosed printing head, as well as the stencil. Additive stencil technology can be applied to either side of the stencil. Building up selected areas on the stencil surface allows the height of selected deposits to be increased by between 10 and 100um compared with the nominal height determined by the main stencil thickness.
This article was originally published on Electronicstalk on 18 June 2004 at 8.00am (UK)
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The stencil can be built up in any area, up to maximum dimensions of 40 x 40mm, to meet customer requirements.
DEK's additive stencil technology is enabled by precision techniques that allow the stencil thickness to be increased by carefully controlled increments, in specific areas of the stencil.
The technique also allows DEK stencil designers to smooth the edges of the enhanced areas, allowing metal squeegees or the wipers of an enclosed head such as the DEK ProFlow transfer head to ride-on and ride-off easily.
This extends the lifetime of the squeegee or wiper, as well as the stencil, and enhances process control and repeatability.
DEK's new technology is suitable when more than one stencil would traditionally be used, or where volumes of paste need to vary, or even for different component placements such as edge connectors.
Manufacturing tolerances are as follows: minimum distance between two deposits is +/-0.5mm; the maximum area is 40 x 40mm; and the deposit thickness is a maximum of 0.075mm.
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