Product category: PCB Assembly Equipment and Tools
News Release from: DEK
Edited by the Electronicstalk Editorial Team on 18 June 2003
Pair to provide flip chip assembly
process
DEK and PacTech USA have formed a technology partnership that leverages the strengths of the two companies for high-volume, high-speed wafer processing and bumping solutions.
DEK and PacTech USA have formed a technology partnership that leverages the strengths of the two companies for high-volume, high-speed wafer processing and bumping solutions By combining PacTech's electroless under bump metallisation (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process
This article was originally published on Electronicstalk on 28 May 2008 at 8.00am (UK)
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