Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK | Subject: DEK-Pro EF
Edited by the Electronicstalk Editorial Team on 22 May 2003
Under-screen cleaning solutions banish IPA
To address both cleaning effectiveness and environmental issues, DEK has launched two new under-screen cleaning products
Both the DEK-Pro EF under screen cleaning solution and its solvent-based twin have been formulated to replace hazardous and health-threatening IPA and other low flashpoint cleaning solvents. Effective cleaning chemicals and solvents play an important role in the wet underside stencil cleaning process.
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The DEK-Pro cleaning products have been developed as a direct result of increasing customer demand from users of mass-imaging systems for efficient and environmental friendly solutions.
Both products are suited for use in all automated screen printing applications.
The DEK-Pro solvent and the DEK-Pro EF solution remove solder paste without effecting the printing capabilities of the paste and, in most applications, the usage rate can be reduced by up to 50% over IPA and other low flashpoint solvents, especially when used in conjunction with DEK's under screen clean rolls.
The DEK-Pro EF solution also improves manufacturing process control, while the HMIS rating, low odour and VOC content amount to excellent health and safety features and help to protect the environment.
The DEK-Pro solvent exhibits excellent drying characteristics, while there are no storage restrictions due to flammability.
Both products are now available via the DEK website.
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