Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK | Subject: PumpPrint process technology
Edited by the Electronicstalk Editorial Team on 21 May 2003
Technology speeds adhesive deposition
DEK has added a new section to its website that consolidates information on the benefits of using PumpPrint process technology for high-speed adhesive deposition
The section may be accessed in a single click from the home page. DEK's new website section includes detailed material on PumpPrint technology as well as technical articles and case studies, with click-throughs to related areas such stencils, process support and customer support. Users may also register to access a detailed process information section.
This article was originally published on Electronicstalk on 21 May 2003 at 8.00am (UK)
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PumpPrint technology enables high-throughput adhesive deposition using a familiar, cost-effective screen printing platform.
A broad range of adhesive patterns with different sizes of glue dots to hold a wide variety of part sizes can be produced in a single print cycle.
New techniques, including ProFlow Direkt imaging, enhance the speed, repeatability and flexibility of PumpPrint deposition, enabling it to far outstrip the capabilities of current adhesive dispensers.
Information on the acrylic stencils used in PumpPrint deposition is also available on the DEK website.
These stencils are now produced in North America, Europe and Asia, on a rapid turnaround and delivery schedule, in response to expanding customer needs.
PumpPrint stencils may be generated using Gerber, HPGL, DXF and ODB++, or DEK can scan the pattern directly from a PCB.
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