Product category: Electronics Manufacturing Machinery and Materials
News Release from: DEK | Subject: ProFlow Via Fill
Edited by the Electronicstalk Editorial Team on 11 March 2003
Process fills vias
faster than squeegees
Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue
The technique uses DEK's award-winning Proflow Direkt Imaging system to achieve excellent fill results with aspect ratios of up to 8:1. The Via Fill system is highly repeatable and results in a throughput of over five times faster than the traditional squeegee-based fill process, as well as greater accuracy.
This article was originally published on Electronicstalk on 11 March 2003 at 8.00am (UK)
Related stories
Shenzhen plant to play major global role
A new state-of-the-art manufacturing facility in Shenzhen is expected to account for 50% of DEK's total worldwide production by the end of 2007
Materials management is key to manufacturability
Process-enabling system brings high volume production to products that might not otherwise be viable
Cost savings resulting from increased utilisation of manpower and considerably reduced wastage are also realised, while process control is significantly enhanced.
The ProFlow-based process solves problems such as insufficient fill, voiding, poor throughput and excessive handling of the product associated with conventional methods.
The fully enclosed ProFlow head is used in conjunction with a sheet of blotting paper underneath the substrate and on top of the tooling block to fill vias in just two print passes, with a paste pressure of 2.5bar and a print speed of 25mm/s.
In addition, the print material has been shown to have a life of over three months in the transfer head.
Traditional manual or squeegee-based systems are not only far less clean and operator-friendly, but they typically take multiple passes to push material into vias.
They can also use a vacuum table to pull material through, resulting in both voids and inadequate deposition.
The ProFlow Via Fill process was developed in conjunction with a major material supplier and two customers.
The aspect ratio of board thickness to hole diameter is typically a challenging problem, although superb results have been achieved with ratios of up to 8:1.
As a result of the increasing demands of higher component and PCB densities, DEK is currently developing the system to cope with aspect ratios as high as 13:1.
• DEK: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• NEW
• Electronicstalk Home Page
Related Business News
Taiwan stocks end down in biggest...
...drop in over 1 yr. Taipei, July 27 (Reuters) - Taiwan shares fell 4.22 percent on Friday to their lowest close in three weeks, marking their largest one-day percentage drop in more than a year, after a sell-off on Wall Street hurt big exporters such as TSMC .
Nippon Oil Aug refining seen flat, eyes Sudan crude
Tokyo, July 27 (Reuters) - Japan's top oil refiner Nippon Oil Corp. will keep its August processing volumes steady versus a year ago to meet summer gasoline demand and is seeking more Nile Blend crude to meet higher utility use.
Fluor Gains Eastman Chemical Gasification Plant Feed Work
Fluor Corporation announced today that it was selected by Eastman Chemical Company to provide front-end engineering and design work for a $1.6 billion gasification project along the Texas Gulf Coast.
Migao Corporation Secures Preferential Natural Gas Prices
Toronto, Ontario-- - Migao Corporation , a leading producer of specialty potash fertilizers for the Chinese market, is pleased to announce that it has negotiated preferential natural gas prices in Sichuan Province from China Petroleum & Chemical Corpora
South Korean envoy to meet Afghan...
...president over hostage crisis. A Seoul presidential envoy heading to Afghanistan will seek an urgent meeting with President Hamid Karzai to try to save 22 South Koreans kidnapped by the Taliban, officials said.
Search the Pro-Talk network of sites
