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Product category: PCB Assembly Equipment and Tools
News Release from: DEK | Subject: Low-volume ProFlow transfer heads
Edited by the Electronicstalk Editorial Team on 13 January 2003

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A new series of low-volume ProFlow transfer heads reduces costs and enhances the precision of high-accuracy mass imaging using very small quantities of high-value materials.

DEK has introduced the first of a new series of low-volume ProFlow transfer heads that reduce costs and enhance the precision of high accuracy mass imaging using very small quantities of high value materials These include fine-particle, low-alpha solder pastes and high gold-content compounds used to create grid arrays and other features in advanced packages such as CSP and flip chip