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Product category: Communications ICs (Wired)
News Release from: DDC United Kingdom | Subject: Micro-ACE
Edited by the Electronicstalk Editorial Team on 04 September 2002

Military databus shrinks into BGA

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A new option offers the smallest footprint of any MIL-STD-1553 integrated terminal in the industry and is the first of its kind offered in a BGA package.

Data Device Corporation (DDC) has expanded its Enhanced Mini-ACE MIL-STD-1553 component offering with the introduction of a ball grid array (BGA) package referred to as the Micro-ACE (u-ACE) This new package has the smallest footprint of any 1553 integrated terminal in the industry and is the first of its kind offered in a BGA package