Gold ball bonder expands chip-on-board options: News from CIL Custom Interconnect

Note: Readers of the free Electronicstalk email newsletter will have read this news when it was announced. Find out how to register for your free copy now.

Custom Interconnect has installed a new F and K Delvotec Model 6200 high speed, hybrid gold ball bonder, the first addition to the company's new manufacturing facility in Andover, Hampshire. This latest investment by CIL is to cater for the growth in its use of thick film ceramic, carbon fibre and other new substrate materials now being used in the electronics manufacturing industry. CIL Managing Director, John Boston, explains: 'The majority of chip-on-board processing is carried out using aluminium wedge bonding; in fact we have installed two new automatic wire bonders recently at CIL'.

'However, we are now being asked to handle other substrate materials and, because of the difference in the metallisation process both on the substrate and in some instances on the die, gold ball bonding is the only solution'.

'The installation of this machine means that, together with our new aluminium wedge bonders, we have a very advanced packaging facility capable of bonding any substrate or die combination that is likely to be required'.

'In addition to CIL work we will also be able to use it in the production of LED arrays for our associate company, CoolLED, where not only are we now producing UV LED arrays but are about to launch products using LEDs of different wavelengths'.

The Delvotec Model 6200 can handle five wire connections per second and with a 35um pad pitch capability is ideal for ultra-fine-pitch work on advanced ball grid arrays.

• CIL Custom Interconnect: contact details and other news
• Email this news to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page