News Release from: Clear Shape Technologies
Edited by the Electronicstalk Editorial Team on 13 June 2005

Clear Shape cashes in on sub-90nm angst

Clear Shape Technologies has raised more than $5 million in its second round of venture financing, bringing total funding to more than $10 million.

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Clear Shape Technologies, a semiconductor design for manufacturing (DFM) software and technologies company, has raised more than $5 million in its second round of venture financing, bringing total funding to more than $10 million. The most recent round was led by Intel Capital, Intel Corp's strategic investment programme, with participation from KT Venture Group, the investment partner of KLA-Tencor. Early in 2004 US Venture Partners led the Series A financing with participation from Telos Ventures and AsiaTech Management.

The current funding round will be used to help accelerate the development and deployment of Clear Shape's DFM software and technologies.

'Given the semiconductor industry's struggle to resolve the intractable DFM problems, we are extremely pleased to have received funding from these leading companies', said Atul Sharan, Clear Shape President and CEO.

'Our mission is to deliver our patented technology to every design team in the world, so they can design confidently for sub-90nm with high yield, maximise the utilisation of process technology, and accelerate time to market'.

'New tools and technologies in the design for manufacturability market segment are essential in building semiconductor products using ever-increasing complex manufacturing process technologies', said Keith Larson, Intel Capital Managing Director, Manufacturing and Digital Health.

'Intel Capital is pleased to lead investments in companies, like Clear Shape, to help accelerate development of technologies that will help design engineers account systematically for manufacturing-related yield issues'.

'Clear Shape has a substantial value proposition for their customers', said Robert Lee, General Partner at KT Venture Group.

'Their approach is in alignment with KLA-Tencor's strategy in addressing the increasingly urgent manufacturing and yield issues that are now extremely design-dependent'.

Jim Hogan, General Partner at Telos Ventures, an early investor in Clear Shape, said: 'In my 30-plus years in the semiconductor industry, rarely have I seen a situation where there is so much angst as a result of such fundamental changes as are being currently witnessed in the design to manufacturing chain'.

'The problems associated with lithography, copper and an inadequate rule-based design tools infrastructure are only getting worse'.

'Clear Shape has a strong and talented technical team spanning both design and process technology'.

'They have a highly innovative approach to closing the critical gap in information and knowledge for the semiconductor industry'.

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