Product category: Heatsinks and Thermal Management
News Release from: Chomerics Europe | Subject: T660
Edited by the Electronicstalk Editorial Team on 15 August 2005
Thermal grease fills
wide and narrow gaps
T660 high performance thermal grease from Chomerics has been designed for use in high power applications that require maximum thermal performance
The new material is noncuring, dispensable and highly conformable. It requires no mixing and is ideal for filling both wide and narrow gaps resulting from variable package tolerances between components and heatsinks or heatspreaders. T660 is a phase change material containing small, performance enhancing conductive particles that melt at 62C.
This article was originally published on Electronicstalk on 15 August 2005 at 8.00am (UK)
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This characteristic helps ensure a minimal bond line and filling of air voids at the component/heatsink interface to maximise thermal conductivity.
The material requires virtually no compressive force in order to deform and flow.
T660 is pale grey in colour and has a thermal conductivity of 0.9W/m-K.
The material is supplied in 3, 15 or 30cm3 syringes ready for dispensing, bulk packaging is also available.
T660 high performance thermal grease is suited to even the most difficult and demanding applications having a continuous use operating temperature range of -50 to +200C.
For applications that do not require the highest performance thermal interface solution Chomerics also offers T650.
This material, which is blue in colour, has a thermal conductivity of 0.8 W/m-K and has all the application characteristics and benefits of T660.
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