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Product category: Heatsinks and Thermal Management
News Release from: Chomerics Europe | Subject: Therm-A-Gap 570 and 580
Edited by the Electronicstalk Editorial Team on 13 December 2004

Fillers mind the (thermal) gap

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Two new thermally conductive gap filling materials provide a thermally efficient interface between heat generating components and heat spreading or dissipating surfaces

Chomerics has two new thermally conductive gap filling materials that combine low force deflection and thermal conductivity to provide a solution that gives a level of thermal management that meets the needs of the majority of applications. Therm-A-Gap 570 and 580 consist of a highly conformable, ultrasoft silicone elastomer filled with ceramic particles.

The materials are able to blanket highly uneven surfaces to provide a thermally efficient interface between heat generating components or PCBs, and heat spreading or dissipating surfaces such as metal enclosures, heatsinks or the equipment chassis.

Typical applications for Therm-A-Gap 570 and 580 can be found in telecomms, computing and automotive modules.

The cost competitiveness of the material also makes it ideal for use in consumer electronics equipment.

Therm-A-Gap 570, which is blue in colour, has a thermal conductivity of 1.5W/m-K (at 69kPa) and a hardness of 40 (shore 00); whereas Therm-A-Gap 580, which is yellow, is targeted at more thermally demanding applications offering higher performance of 2.5W/m-K and a hardness of 60 (shore 00).

Both materials are available with either an aluminium foil or glass-fibre carrier.

Aluminium foil versions are coated with a pressure sensitive adhesive on one side that helps placement accuracy.

A choice of material thicknesses from 0.5 to 5mm coupled with the ease with which the material can be compressed, means that a suitable variant can be found for most applications.

Both materials also provide a degree of electrical isolation with a quoted dielectric strength of 10kV/mm.

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