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Product category: Heatsinks and Thermal Management
News Release from: Chomerics Europe | Subject: Thermflow T766
Edited by the Electronicstalk Editorial Team on 08 July 2002

Thermal interface simplifies heatsink
removal

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Thermflow T766 phase-change material provides a low thermal resistance interface between hot components and heatsinks.

Thermflow T766 phase-change material from Chomerics provides a low thermal resistance interface between hot components and heatsinks Typical applications are found in thermal modules in laptop computers and between microprocessors and heatsinks in PCs