Product category: Design and Development Software
News Release from: Celestry | Subject: TSMC qualification
Edited by the Electronicstalk Editorial Team on 18 April 2002
TSMC qualification for sign-off tools
Celestry Design Technologies has achieved qualification of three of its design tools for Taiwan Semiconductor Manufacturing Company (TSMC) 0.13-micron process
The qualified tools include the RelPro+ and RelXpert products for Hot Carrier Injection (HCI) effects, and the AnalogXpert product for device mismatch simulation analysis for TSMC's analogue/mixed-signal (AMS) process technologies. At the 0.13-micron node, new physical effects result from the use of copper, more metal layers, thinner gate insulators, smaller device geometries and the effects of functional integration within the die.
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Designers who want to push higher performance while maintaining high yields must deal with these factors through physical analysis tools, such as those available from Celestry.
"The qualification of Celestry's physical analysis design tools is a key step in providing designers with the capabilities they need for fast time-to-volume", said Genda Hu, vice president of marketing at TSMC.
"With optimised technology files, designers can reduce their design time, facilitate better chip performance through careful calibration and validation, and increase the likelihood of first silicon successes".
"We are pleased that TSMC continues to recognise our commitment to deliver industry-leading nanometre SoC design tools and our unique hands-on silicon experience that allows our customers to maximise their use of the latest IC processes with our silicon-accurate sign-off solutions", remarked Dr Zhihong Liu, president and CEO of Celestry.
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