Product category: Design Services
News Release from: Cadence Design Systems | Subject: VCAD collaborative environment
Edited by the Electronicstalk Editorial Team on 3 July 2003
CAD services speed camera to tape-out
Cadence has provided TransChip with ongoing support via its VCAD collaborative environment to develop a design flow for TransChip's TC5700 single-chip CMOS camera
Cadence supported TransChip to maintain the company's initial design environments, as well as providing layout consultancy. Conventional imaging solutions typically require multiple chips. TransChip implemented the camera solution by developing a programmable solution that provides all necessary functionality, including image capture, colour processing and compression, on a single chip.
This article was originally published on Electronicstalk on 3 July 2003 at 8.00am (UK)
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TransChip required a design environment that could incorporate the limiting factors of very low power, timing convergence and small die area while taking advantage of the high integration capability of CMOS chips and enabling the integration of analogue, digital and external IP circuits onto the same chip.
The Cadence team provided the back-end design during the initial design stages for a prototype test chip using the Cadence Encounter digital IC design platform's RTL-to-GDSII solution, SoC Encounter, which enabled TransChip to complete the design and silicon tape-out of their latest CMOS imager design in less than four months.
"Cadence's comprehensive toolset for mixed-mode design, ease of collaboration between our design teams and extensive expertise in CMOS integration made Cadence the right partner to help us to produce the world's most compact single-chip imaging and compression solutions", said Viktor Ariel, CEO of TransChip.
"All TransChip's tape-outs based on Cadence design flow and software tools have worked on the first pass.
We look forward to strengthening our relationship with Cadence in the future".
"The CMOS imager project with TransChip is further validation of the Cadence service model", said Guillaume d'Eyssautier, Vice President and General Manager for Cadence Europe.
"Producing a single-chip multifunction solution for imaging means overcoming many new design challenges.
The Cadence service team worked with TransChip throughout the entire process to deliver optimum design success, developing a complete design flow, creating and maintaining the initial design environments and assisting with layouts".
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