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Product category: Design and Development Software
News Release from: Cadence Design Systems
Edited by the Electronicstalk Editorial Team on 28 February 2002
ChipPAC standardises on Cadence packages
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ChipPAC has standardised on Cadence Advanced Package Designer and Advanced Package Engineer to further automate its IC packaging design process and reduce cycle times.
ChipPAC, one of the world's largest and most diversified semiconductor packaging, test and distribution providers, has standardised on the Cadence integrated circuit (IC) packaging design suites, Advanced Package Designer and Advanced Package Engineer, to further automate its IC packaging design process and reduce cycle times The design solutions are used to support all of ChipPAC's advanced IC packages including BGA, CSP and flip chip
This article was originally published on Electronicstalk on 20 Nov 2001 at 8.00am (UK)