Product category: Electronics Manufacturing Quality Assurance
News Release from: Blundell Production Equipment | Subject: Ersa IR550
Edited by the Electronicstalk Editorial Team on 7 January 2005
Camera puts rework in the picture
A new camera system is available for the Ersa IR550 BGA rework and replacement station, enabling the user to actually watch the reflow process as it happens
A new camera system is available for the Ersa IR550 BGA rework and replacement station, enabling the user to actually watch the reflow process as it happens, resulting in much more control over the component re-attachment process. Utilising Ersa's unique RPC camera system, the rework station user can visually monitor the reflowing of every component at 50 times magnification, to ensure that the essential 'double drop' takes place as it should.
This article was originally published on Electronicstalk on 7 January 2005 at 8.00am (UK)
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The uniform heating system of the IR550 minimises temperature variations to ensure that all the connections are reflowed at the same time.
This is a very important requirement for lead free work, where the process window is much tighter than was previously required for tin-lead solder.
The IR550 works with medium wave IR radiators that operate at a frequency where absorbtion and reflection are identical.
This means that regardless of component colour, surface finish or material, all the joints, whether hidden (as in BGA) or open (as with most leaded devices) are heated uniformly.
A temperature variation of better than 2C can be achieved, allowing BGAs to self align and double drop in a controlled manner.
Virtually every type of surface mounted component can be reworked on the IR550, and it will handle through hole components up to 135mm square.
The unit has a built in memory for heating profiles, and once a component of a particular type has been successfully removed, the optimum heat profile for that component is stored for future use.
The addition of the PL550 split vision alignment system gives the user the ability to accurately place fine pitch devices with ease and accuracy.
BGAs and most other surface mounted components can be removed and replaced safely and efficiently.
The IR550 can also be used as a one-off BGA placer for low volume assembly.
The small optical profile of the RPC camera means it can see through the slightest gaps between other components to view the underside of devices such as micro-BGAs, even if the device is completely surrounded by other components.
The Ersa IR500 is available in the UK from Blundell Production Equipment.
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