Product category: Electronics Manufacturing Machinery and Materials
News Release from: Blundell Production Equipment | Subject: CMS 400 lead-free upgrade
Edited by the Electronicstalk Editorial Team on 20 October 2003
Wave-soldering machines gain lead-free upgrade
A one-day on-site upgrade can convert the CMS 400 wave-soldering machine to operate safely with lead-free solder
Erosion problems can occur when a wave-soldering machine is filled with lead-free solder alloy. This is due to the high tin content of SnAgCu alloys, which are tipped to become the most common replacement for tin-lead solders. Some early users of lead-free solder have experienced severe damage to their stainless-steel solder baths and solder nozzles, also resulting in significant iron contamination of their expensive lead-free solder.
This article was originally published on Electronicstalk on 20 October 2003 at 8.00am (UK)
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Blundell Production Equipment is offering to convert the 450-odd CMS 400 wave-soldering machines that are in use in the UK to work safely with lead-free solder.
This will involve fitting an exchange solder bath, with all stainless-steel parts coated with a special tin-resistant material.
Blundell will also fill the new solder pot with lead-free solder and fit the new bath at the customer's site.
The work only takes one day, but the lead time is 4 to 6 weeks.
Wave soldering machine users are being urged by Blundell to make the change sooner rather than later, as high demand is predicted on the run up to the deadline date of 31st July 2006, after which all commercially produced PCBs will have to be totally lead free.
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