Product category: Electronics Manufacturing Quality Assurance
News Release from: Blundell Production Equipment | Subject: Ersascope
Edited by the Electronicstalk Editorial Team on 30 September 2003
BGA inspection demands a closer look
Paul Cooper, Product Manager at Blundell Production Equipment, explains why visual inspection is preferable to X-ray analysis in evaluating BGA joints.
Paul Cooper, Product Manager at Blundell Production Equipment, explains why visual inspection is preferable to X-ray analysis in evaluating BGA joints What problems are you seeing with your BGA assembly and soldering process
This article was originally published on Electronicstalk on 23 Jul 2002 at 8.00am (UK)
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Well some of you are not seeing at all, at best you may be relying on someone's evaluation of a grey image from X-rays to determine whether your process is under control or not.
Let me tell you that a good majority of BGA joints that we see, using the Ersascope, you would not accept elsewhere within your process.
If you saw solder joints on gullwing devices that where dull or grainy you would modify your process until they became clean, bright and smooth.