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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Best | Subject: StencilQuik
Edited by the Electronicstalk Editorial Team on 27 May 2004
Stencilling technique simplifies BGA
rework
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Best has developed a newly patented process for the faster and more reliable reworking of BGAs, CSPs and other area array devices.
Best has developed a newly patented process for the faster and more reliable reworking of BGAs, CSPs and other area array devices Using the StencilQuik process most standard pitch BGAs can be placed into the PCB by hand in 10min or less