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Product category: PCB Assembly Equipment and Tools
News Release from: Assembleon | Subject: AX-3 SMD placement system
Edited by the Electronicstalk Editorial Team on 11 April 2005
Parallel placement concept delivers high
uptime
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Assembleon is showing its advanced AX-3 SMD placement system at Elkom 2005 in Helsinki.
On Booth K35 in Hall 6 at Elkom 2005 (from 19th to 21st April at the Helsinki Fair Centre), technology leader Assembleon is showing its advanced AX-3 SMD placement system The AX-3 chip and IC placer provides easily expandable placement capability for mid- to high-volume high-mix manufacturing