Product category: Electronics Manufacturing Machinery and Materials
News Release from: Assembléon | Subject: Equipment at APEX 2003
Edited by the Electronicstalk Editorial Team on 17 January 2003
High-volume SMT processes
demonstrated at APEX
Innovation is the keyword at APEX 2003, where Assembleon will deliver a demonstration of the way high-volume electronics manufacturers will be acquiring SMT production capacity over the next decade
All will be revealed in a 3D vision experience - "The next dimension" - that the company describes as a must-see for any manufacturer looking for a head start in the race to market supremacy as the industry emerges from the downturn. Other advanced pick-and-place technology on the stand includes the new Fine Pitch Module which, in combination with Assembleon's FCM Multiflex chipshooter provides scaleable production capacity from 100,000 to 200,000 components per hour throughput, with from 260 to 520 part numbers supporting family setup for fast changeovers in high-mix environments.
This article was originally published on Electronicstalk on 17 January 2003 at 8.00am (UK)
Related stories
Pick and place machine accurate to within 30micron
A fine-pitch pick-and-place-machine places fine-pitch and odd-form components with an accuracy to within 30um at a rate of 6,800 components per hour
System places components accurately
Assembleon's AX-201 places 01005 components, fine-pitch devices and odd-form components up to 130 x 79mm with machine vision and laser alignment ensuring accurate board and component positioning
Together, the Multiflex and Fine Pitch Module provide the complete placement capability, saving a machine in many applications.
The Fine Pitch Module protects investment with the ultimate in flexible configuration, a very broad range of feeders and nozzles, and limitless applications in automotive, computer, telecommunications, consumer, and module manufacturing industries.
Features of the Fine Pitch Module include the broadest component range on the market - from ICs, through advanced packages to oddforms, patented Continuous Calibration for best-in-class 25 micron at 4 sigma placement accuracy, and state-of-the-art software solutions.
Further reading
Danish rep supports pick and place platforms
Assembleon has signed a representative agreement with HIN to strengthen its sales and service presence in Denmark
Exclusive Russian distribution for single company
Assem Rus, will be the sole distributor for Assembleon's entire portfolio of products and services within the republics of the Russian Federation and Belarus
Commonality of feeders, set-up and utilities with the Multiflex, together with single-sided operation and a touchscreen user interface enhance ease of operation.
Assembleon will also be showing advanced feeder technology which boosts the capacity and performance of the FCM Multiflex.
An innovative Twin Tape Feeder sets a new standard in optimised, efficient and intelligent tape feeding.
The unique feeder design, based on Dual Tape Single Slot (DTSST) technology, enables the user to increase 8mm SMD tape component part numbers on the FCM Multiflex chipshooter by over 60% to 160.
The new feeder technology supports lean manufacturing by enabling users to fulfil their placement requirement with the highest output on the smallest footprint.
The availability of additional lanes allows the user to improve component balancing, even further reducing cycle times.
This advantage may also be exploited by users for whom the existing 96 slots seem sufficient for production.
Expanded feeder capacity provides opportunities for family setup, with faster changeovers adding to efficiency and cycle time benefits.
Integrated intelligence allows zero-error set-up, programmable index settings, lot traceability, internal diagnostics, empty-reel advanced warning and repair history, and is splice detection prepared.
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