Database helps with MEMS packaging

ASM International is compiling a database of materials used in packaging for microelectromechanical systems.

MEMS (microelectromechanical systems) technology represents an entirely new level of challenges in integrating microsystems.

Whereas conventional microelectronic chips, complex though they are, interact with their environment through the single medium of electronic signals, MEMS devices interact not only electronically, but also through the additional media of motion, pressure, temperature light or combinations of them.

In these microdevices, therefore, the control of the environment through which the multiplicity of interactions occur becomes a challenge to the designer and manufacturer in terms of cost, schedule and functionality of the design.

Packaging of these devices must provide protection against undesired interactions while facilitating the desired ones.

A packaging system, rather than material, is required for success of the MEMS device.

It is estimated that cost and time required to bring a MEMS device to market is at least doubled by packaging concerns.

"ASM International has recognised the challenges that are posed by this growing and significant segment of the microelectronics industry", says ASM Technical Director James M Marder.

"In response to the needs of this constituency, we have undertaken the construction of a database of materials used in packaging systems".

This database encompasses mechanical, physical, electrical and optical properties, suppliers and successful applications along with a knowledge base of desirable and undesirable interactions with the environment and other considerations that can limit or recommend the use of a particular material.

This database is being constructed with the participation of ASM's member volunteers who have recognised expertise in the MEMS design arena.

Notable among the contributors are the staff Orbital Research Corporation of Cleveland, Sandia National Laboratory, and the members of the Electronic Device Failure Analysis Society (EDFAS), an Affiliate Society of ASM.

This group of collaborators brings to the creation of this database a knowledge of materials, device design, device manufacture and operational history that will provide the combination of disciplines that can have a dramatic impact on the successful and timely implementation of new MEMS devices.

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