Product category: Test Accessories
News Release from: Ardent Concepts | Subject: Strip Test Contactors
Edited by the Electronicstalk Editorial Team on 21 October 2003
Test interface lines
up eight IC packages
Ardent Concepts has developed a strip test interface technology for IC packages
The new contactor is designed to test eight devices simultaneously, and satisfies demands from customers trying to improve throughput with multi-device panel manufacturing processes. "Our customer needed a solution that matches their current footprint and has a more flexible design for cleaning and repair", says Steve Cleveland, Vice President of Sales for Ardent Concepts.
This article was originally published on Electronicstalk on 21 October 2003 at 8.00am (UK)
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"Contact resistance and force requirements were met without sacrificing signal integrity or contactor life.
We are proud to deliver this technology to the market, and can now offer this solution in a number of configurations".
Ardent Concepts leads the industry of high performance interconnect innovation with its proprietary wire form compliant contact technology, the Redundant Contact.
The all-metal contact technology offers electrical invisibility with a measured self inductance of 0.5nH and a -1dB loop-through bandwidth of 24GHz and a -3dB bandwidth over 30GHz in 0.5mm-pitch configuration.
The Redundant Contact achieves low contact resistance by using a low surface area contact patch.
This allows engineers to design high-node-count interconnections without high levels of contact force.
The Redundant Contact is able to accommodate a wide variety of applications in area array and peripherally leaded interconnect designs.
The Redundant Contact can achieve pitches of 0.25mm, and is capable of Kelvin contacting on 0.5mm-pitch devices.
The contact technology is ideal for RF testing of various package types including QFN packages, PCB to PCB as well as all other chip scale, flip chip, substrate and other packaged IC interconnections.
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