Product category: Design and Development Software
News Release from: Ansoft Europe | Subject: HFSS v9.2
Edited by the Electronicstalk Editorial Team on 5 May 2004
Memory expansion broadens
scope of simulation
A new version of HFSS is available for designers of high-speed and high-frequency applications, including IC devices and microwave/RF components
This new release doubles the size of addressable 3D designs through access to additional memory on Microsoft Windows-based PCs, enhances the ability to automatically generate and manage electromagnetic-based design libraries through native HFSS user defined primitives (UPDs), and provides seamless 3D electromagnetic, circuit and system cosimulation with Ansoft Designer/Nexxim.
This article was originally published on Electronicstalk on 5 May 2004 at 8.00am (UK)
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"Our many SiGe foundry customers are requesting support for design and verification of high-speed circuits with ever-increasing complexity, and we have found great utility in the enhancements of HFSS v9.2 to support our needs in developing interconnect modelling solutions for customer design enablement", said Raminderpal Singh, Senior Engineering Manager, IBM Microelectronics.
"HFSS allows us to analyse the most challenging complex IC interconnect and package designs".
The most broadly applicable enhancement to HFSS v9.2 is its increased access to a full 3Gbyte of memory on Windows-based PCs.
This increase effectively doubles the capacity of addressable designs by HFSS.
The addition of UDPs in HFSS v9.2 provides for customer-specified geometric constructs and user-customisable libraries of parts.
HFSS v9.2 also features tighter integration with Ansoft Designer and Nexxim through a dynamic parameterised link that allows seamless 3D electromagnetic cosimulation for RF/mixed-signal circuit simulation.
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