Product category: Design and Development Software
News Release from: Ansoft Europe
Edited by the Electronicstalk Editorial Team on 18 April 2002
HFSS adds integrity to ASAT's designs
ASAT has chosen Ansoft's HFSS high-frequency structure simulator for its high-frequency 3D simulations and signal-integrity analysis
Adoption of the HFSS software is currently being implemented throughout ASAT's worldwide design centres. Ansoft's HFSS software allows ASAT designers and engineers to verify the integrity of designs during the design phase of the package rather than after the final packages are committed to production.
This article was originally published on Electronicstalk on 18 April 2002 at 8.00am (UK)
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As a result, ASAT provides a reduction in cycle time and delivers a cost-effective solution to its customers.
The versatile software is used for multiple applications, including substrate, lead frame, modular system package (MSP) and flip-chip designs.
"By determining signal integrity concurrently with the design, we are able to accurately predict the performance of the package before any resources are committed to assembly", said Ed Combs, vice president of engineering at ASAT.
"By implementing Ansoft's HFSS software, we've been able to dramatically minimise the number of design iterations.
This enables us to provide a package solution that meets our customers' expectations and works the first time".
Tom Flynn, Ansoft's vice president of sales, said, "An increasing number of engineers use HFSS within their high-speed product design flows, and I'm very pleased that ASAT chose the software to analyse their high-performance designs.
Because of HFSS's unique flexibility and power, designers can easily adapt and integrate it into their design flow from concept to final signoff simulation".
"With the continuous increase in bandwidth requirements and lower operating voltages, it is no longer acceptable to simply provide lumped RLC equivalent circuits", said Edmund Law, director of design at ASAT.
"3D analyses for solving ball-grid array (BGA) package structures, including high-density array BGA packages and thermally enhanced array packages, are now required for wire bonds, pads, traces, solder balls, and power and ground planes.
Ansoft's HFSS allows us to complete these analyses in a timely manner".
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