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Product category: Design and Development Software
News Release from: Ansoft Europe | Subject: Turbo Package Analyser V4
Edited by the Electronicstalk Editorial Team on 28 June 2001
Analysis stretched to latest IC packages
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Ansoft has upgraded its advanced semiconductor packaging design tool, Turbo Package Analyser (TPA).
Ansoft has upgraded its advanced semiconductor packaging design tool, Turbo Package Analyser (TPA) With this new release, TPA automates the analysis of all complex semiconductor packages, including flip-chip, chip scale package, and multiple die system-in-package designs