Product category: Power Supply ICs and Controllers
News Release from: AMI Semiconductor | Subject: I3T50 smart power
Edited by the Electronicstalk Editorial Team on 20 May 2003
Deep trench isolation shrinks smart
power SoCs
A new high-voltage mixed-signal technology reduces component count and cost and delivers high-density ASICs with chip areas that are up to 40% smaller than previous SoC solutions.
A new high-voltage, mixed-signal technology from AMI Semiconductor (AMIS) reduces component count and cost and delivers high-density ASICs with chip areas that are up to 40% smaller than previous SoC solutions The new I3T50 smart power technology will simplify the implementation of designs requiring high-performance, compact and robust ASICs and ASSPs and operation up to 50V
This article was originally published on Electronicstalk on 26 Mar 2001 at 8.00am (UK)
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