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Product category: PCB Assembly Equipment and Tools
News Release from: Alliance Sales (Europe) | Subject: Neptco Wafertape
Edited by the Electronicstalk Editorial Team on 06 June 2003
Tape reduces wafer waste
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A new range of wafer dicing tapes designed to assure consistent, precise and repeatable wafer production yields has been introduced to Europe by Alliance Sales (Europe).
A new range of wafer dicing tapes designed to assure consistent, precise and repeatable wafer production yields has been introduced to Europe by Alliance Sales (Europe) Neptco's Wafertape range of dicing tapes reduce silicon residues by applying superior coating technology that features total thickness variation (TTV) control, an expandable base film plus a special low-extractable release liner