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Product category: Test Accessories
News Release from: Aries Electronics | Subject: Burn-in and test sockets
Edited by the Electronicstalk Editorial Team on 14 June 2005
Test socket boasts broad coverage
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A new test and burn-in socket accommodates device packages from 41 to 55mm2 in applications up to 1GHz.
Aries Electronics has introduced a test and burn-in socket that accommodates device packages from 41 to 55mm2 in applications up to 1GHz The new size, which features a standard moulded socket format, is ideal for the test and burn-in of IC devices such as SRAM, DRAM, DSP and Flash, as well as packages including CSP, MicroBGA, LCC, LGA, QFP, QFN and MLF
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