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Product category: Test Accessories
News Release from: Aries Electronics | Subject: CSP/uBGA test and burn-in socket
Edited by the Electronicstalk Editorial Team on 29 September 2003
Socket puts CSPs and uBGAs to the test
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A new CSP/uBGA test and burn-in socket can handle devices from 14 to 27mm2, in applications under 1GHz.
A new CSP/uBGA test and burn-in socket can handle devices from 14 to 27mm2, in applications under 1GHz The new pressure-mounted socket requires no soldering and is ideal for test and burn-in of CSP, uBGA, DSP, LGA, SRAM, DRAM and Flash devices with a pitch of 0.50mm and larger
This article was originally published on Electronicstalk on 8 Apr 2002 at 8.00