Product category: Frequency Control Components
News Release from: Avago Technologies | Subject: ACPF-7003
Edited by the Electronicstalk Editorial Team on 17 February 2005
Full-band PCS filter cuts out RF switch
Agilent Technologies has developed a higher-performance FBAR full-band transmit filter for handsets, data cards and other wireless products operating in the US PCS frequency band.
Agilent Technologies has developed a higher-performance film bulk acoustic resonator (FBAR) full-band transmit filter for handsets, data cards and other wireless products operating in the US PCS (personal communications service) frequency band Compared with full-band SAW (surface acoustic wave) transmit filters offered by competitors, Agilent's FBAR filter provides superior performance in an equivalent or smaller package
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The Agilent ACPF-7003 features higher rejection - 35dB minimum, 45dB typical in the 1930-1990MHz receive band - than Agilent's widely used ACPF-7002 full-band filter.
It also offers lower maximum insertion loss over portions of the 1850-1880MHz transmit band and improved input and output match to 50ohm.
In typical CDMA handset architectures, the transmit filter is incorporated between the driver amplifier and the power amplifier to reduce noise in the receive band, thereby enhancing receiver sensitivity.
The high rejection capability of Agilent's miniature FBAR transmit filter keeps out unwanted signals, and its low insertion loss increases transmitter efficiency and performance.
Many CDMA handset designs use two SAW split-band filters to cover the 1850-1880 and 1880-1910MHz portions of the PCS transmit frequency range, with the appropriate filter selected via a radio-frequency switch.
Agilent's FBAR full-band filter eliminates the need for a second filter, a radio-frequency switch and associated passive components.
This space savings reduces the printed circuit board area required for the transmit filter by up to 90%, while lowering manufacturing costs and eliminating the need for interface design and programming.
The ACPF-7003 is built with Agilent's innovative Microcap bonded-wafer chip scale packaging technology.
This process allows the ultra-small filter to be assembled in a moulded-chip-on-board module that is less than 1.0 mm high with a 1.6 x 2.0mm footprint.
The filter is specified over the -30 to +85C operating temperature range.
The Agilent ACPF-7003 is available now through Agilent's direct sales channel and worldwide distribution partners. Request a free brochure from Avago Technologies ...
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