Product category: Analogue and Mixed Signal ICs
News Release from: Avago Technologies | Subject: AMMP series
Edited by the Electronicstalk Editorial Team on 23 July 2004
MMICs packaged for surface-mount
production
The AMMP series of millimetre-wave integrated circuits is packaged in an innovative 5 x 5mm low-cost surface-mount package compatible with automated assembly techniques.
The AMMP series of millimetre-wave integrated circuits is packaged in an innovative 5 x 5mm low-cost surface-mount package compatible with automated assembly techniques These packaged parts allow customers to move the entire radio frequency (RF) block diagram to lower-cost, surface-mount manufacturing rather than continue with more costly chip and wire assembly manufacturing that requires complex tuning and assembly processes
This article was originally published on Electronicstalk on 6 Oct 2005 at 8.00am (UK)
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