Product category: Communications ICs (Wireless)
News Release from: Agere Systems | Subject: Sceptre HPE
Edited by the Electronicstalk Editorial Team on 07 December 2006
Baseband slims down for thinnest handset
Samsung Electronics has delivered to market what it claims to be the thinnest cell phone ever made.
Using Agere Systems' innovative chip packaging design technique, Samsung made its Ultra Edition 6.9 (X820 bar design) and Ultra Edition 9.9 (D830 clamshell design) cell phones the thinnest ever among its form factors The Agere technique is called package-on-package (stacking) in which a packaged memory chip is stacked on top of the baseband chip package to reduce the overall area footprint
This article was originally published on Electronicstalk on 13 Nov 2003 at 8.00am (UK)
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