Product category: Communications ICs (Wireless)
News Release from: Agere Systems | Subject: AGRA10, AGR09030, AGR09045, AGR09060 and AGRB10
Edited by the Electronicstalk Editorial Team on 24 March 2004
Plastic packages cut RF transistor costs
Five new high-performance overmoulded plastic packaged transistor products reduce the costs of RF transistor packaging up to 25%.
Five new high-performance radio frequency (RF) overmoulded plastic packaged transistor products reduce the costs of RF transistor packaging up to 25% Agere's new solutions will lower the overall costs and accelerate deployment of a vast array of wireless basestation amplifier equipment
This article was originally published on Electronicstalk on 8 Mar 2007 at 8.00am (UK)
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