Product category: Programmable Logic Devices
News Release from: Altera Europe | Subject: Cyclone III
Edited by the Electronicstalk Editorial Team on 26 March 2008
FPGAs find even smaller packages
Package offers the highest amount of logic and I/Os for the footprint, allowing engineers to use FPGAs in new applications.
Providing designers with the highest density FPGA per board area, Altera has added the option of 8 x 8mm packaging (M164) for its family of 65nm Cyclone III FPGAs Designers of space-constrained high-volume applications in consumer, military and industrial markets can now take advantage of the combined lowest power and density leadership of the Cyclone III devices
This article was originally published on Electronicstalk on 24 Dec 2007 at 8.00am (UK)
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Built on TSMC's 65nm low-power process, the Cyclone III family includes devices that are qualified for commercial, industrial and extended temperatures.
FPGAs take on power- and cost-sensitive tasks
The industry's first 65nm low-cost FPGAs consume 75% less power than competing devices.
"Our customers value small, fast, smart and low-cost solutions in our Mercury Encoders", says Paul Remillard, Director, Electronic Systems Engineering, MicroE Systems.
"We chose Cyclone III FPGAs because of the high functionality and performance that is provided in the ultra-small 8 x 8mm package".
"Furthermore, the low-power, low-heat dissipation of Cyclone III FPGAs makes it easier for us to integrate FPGAs into our new product's small form factors".
The new 8 x 8mm 164-pin package with up to 16K logic elements (LEs) extends the Cyclone III FPGA's high-density small-package offering that includes 14 x 14mm 256-pin (U256) and 17 x 17mm 484-pin (U484) packages.
Each of these packages offers the highest amount of logic and I/Os for its footprint, allowing engineers to use FPGAs in new applications, such as handheld radios, satellite phones, I/O modules and consumer displays.
Cyclone III devices consume 75% less power than competing FPGAs while delivering 5K to 120K LEs, up to 4Mbit of memory and up to 288 digital signal processing (DSP) multipliers.
Further, the Cyclone III FPGA family delivers as much as 60% faster performance than competing low-cost FPGAs.
Built on TSMC's 65nm Low-Power (LP) process, the Cyclone III family includes devices that are qualified for commercial, industrial and extended temperatures.
"Many designers of high-volume applications need a solution that provides maximum functionality with the lowest power while using minimal board space", says Luanne Schirrmeister, Director of Marketing, Low-cost Products, Altera Corporation.
"Our complete lineup of small packages allows designers with demanding space constraints to use the most advanced high-volume, low-power FPGA in the market".
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