Product category: Embedded Software and Operating Systems
News Release from: Adeneo | Subject: Win CE BSP for LPC3000
Edited by the Electronicstalk Editorial Team on 26 April 2007

Package puts Win CE on NXP micros

Adeneo has collaborated with NXP to produce a Windows Embedded CE 6.0 board support package for the LPC3000 MCU family

The company is offering a binary evaluation version for free, and the commercial version is available for a one-time licence fee, with no royalties. Yannick Chamming's, General Manager of Windows Embedded activity at Adeneo, and CEO of Adeneo America says: 'The fact NXP chose Adeneo as their strategic partner for the development of the official Windows Embedded CE 6.0 BSPs for their MCUs is a key confirmation of our position as a 'go between' Microsoft and silicon vendors like NXP.

With more than 250 engineers with a complete system expertise, both on hardware and software design, we bring a reliable answer to OEMs willing to secure the design of their embedded products in the best time to market'.

Geoff Lees, Product Line Manager at NXP, adds: 'We are very pleased with Adeneo's commitment in porting Windows Embedded CE to the LPC3180'.

'This demonstrates the power management features of LPC3000 family which is essential for many portable applications'.

'This port gives LPC3000 users a choice of working with experienced Windows Embedded CE Gold Partner'.

Thomas L Walker, Director of Phytec America, commented: 'Our partnership with Adeneo increases the value of phytec's off-shelf single board computer subassemblies to OEM users'.

'Deployment of an insert-ready Phytec SBC already significantly reduces our end users' development time and design risk, allowing them to focus on the application-specific I/O and software issues of a development rather than the task of designing and validating complicated circuitry around a complex Windows Embedded CE-capable processor'.

'Adding Adeneo's Windows Embedded CE expertise and board support packages further enhances our off-shelf products, as we can now provide a full hardware and software solution'.

'As a Windows Embedded Gold Partner, Adeneo is a key part of the continually expanding Windows Embedded ecosystem', said Ilya Bukshteyn, Director of Windows Embedded Marketing at Microsoft Corp.

'Adeneo's advancement of next-generation tools and BSPs based on Windows Embedded CE 6.0 complements our joint initiatives for rapid time to market for systems designs'.

'This, combined with their deep expertise in hardware and software designs, provides an ideal solution for OEMs'.

Because of its compliance with Microsoft PQOAL (Production-Quality OEM Adaptation Layer) and PQD (Production Quality Device) specifications, these BSPs are the most cost-effective way to develop custom solutions on NXP chips under Windows Embedded CE with the minimal redesign.

Only the portions of the BSPs handling board features need to be reviewed and redesigned and all code linked to the core CPU can be reused without modifications.

The BSPs includes all the drivers for most of the peripherals integrated in LPC3xxx chips.

This allows targeting all types of custom solutions.

The BSPs are qualified using the Windows Embedded CE official test kit, and has been designed to take full advantage of the advanced features of the LPC3xxx such as advanced power management for both idle and suspend mode.

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